Digitálny katalóg

For the adsorption of general workpieces

To be used when no space to install a buffer or when the adsorption surface is slanted

Suitable for handling spherical or inclined workpieces

Appropriate for workpieces with curved surfaces

For the adsorption of small components such as IC chips

Tailored for long and narrow workpieces with adsorption surface limitations

For workpieces with bumps

Suitable for the adsorption of circular components like CDs and DVDs

To be used for the adsorption and holding of the stage of panels, glass circuit boards, etc.

For the adsorption of general workpieces

To be used when no space to install a buffer or when the adsorption surface is slanted

For spherical workpieces or workpieces with inclined surfaces

Appropriate for workpieces with curved surfaces

Tailored for long and narrow workpieces with adsorption surface limitations

For the adsorption of small components such as IC chips

For workpieces with bumps

For the adsorption of general workpieces

To be used when no space to install a buffer or when the adsorption surface is slanted

Appropriate for workpieces with curved surfaces

Tailored for long and narrow workpieces with adsorption surface limitations

For the adsorption of general workpieces

To be used when no space to install a buffer or when the adsorption surface is slanted

Appropriate for workpieces with curved surfaces

Tailored for long and narrow workpieces with adsorption surface limitations

Vacuum pad and ejector are integrated for space savings.  The two-stage ejector increases suction flow up to 50% and reduces air consumptions up to 30%.  Design features allows for daisy-chain piping and the mounting with lock plates makes for easier maintenance.